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Published: Sep, 2015 | Pages:
16 | Publisher: Market Intelligence & Consulting Institute
Industry: Semiconductors | Report Format: Electronic (PDF)
Driven by the development of mobile devices, the worldwide IC packaging and testing industry saw a significant growth in 2014. With leadership in technology and production capacity, the Taiwanese IC packaging and testing industry has enjoyed the highest growth in the world. As the availability of wearable devices and the IoT (Internet of Things) increases, new opportunities and challenges await the Taiwanese IC packaging and testing industry. This report recaps the recent development of the worldwide and Taiwanese IC packaging and testing industry while forecasting their developments in 2015 and beyond from the aspects of market trends and industrial structure. List of Topics Overview of the major trends in the worldwide and Taiwanese IC packaging and testing industries, including major vendors' rankings by revenue in 2014 and market share by region from 2012 to 2015. Also provided are shipment value forecasts of the worldwide and Taiwanese IC packaging and testing industries from 2015 to 2017 Highlights of the industry's future development, touching on vendors' capacity expansion activities from 2013 to present, growing demand for SiP technology due to wearable devices and IoT, and development of high-end heterogeneous packaging technologies List of Companies Amkor Technology ASE ASE Embedded Electronics Inc. Chipbond Technology ChipMOS FCI Greatek Electronic JCET J-Device Micron Nepes OCZ Panasonic Promos PTI Renesas Samsung SK Hynix SMIC SPIL STATS ChipPAC TDK Tianshui Huatian Technology Toshiba TSMC UTAC Wuxi Tongzhi Microelectronics Xilin
Table of Contents 1. Trends in Worldwide and Taiwanese IC Packaging and Testing Industries 1.1 China's Market Share Sees Fastest Growth 1.2 Uncertain Market Growth for 2015 2. Future of Worldwide and Taiwanese IC Packaging and Testing Industries 2.1 Aggressive Expansion 2.2 SiP to Become Key Technology 2.3 Influence of IC Foundries' Development of High-end Heterogeneous Packaging Technologies Conclusion Industry's Optimism about the Future on the Wane Enhancement in Technology and Production Capacity as Key to Stay Ahead Appendix Glossary of Terms List of Companies
List of Tables Table 1: Worldwide and Taiwanese IC Packaging and Testing Vendor's Capacity Expansion, 2013 - 2015 List of Figures Figure 1: Worldwide Top 10 IC Packaging and Testing Vendors by Revenue, 2014 Figure 2: Worldwide IC Packaging and Testing Market Share by Region, 2012 - 2015 Figure 3: Worldwide and Taiwanese IC Packaging and Testing Industry Shipment Value, 2014 - 2017 Figure 4: Evolution of End-User Devices and Packaging Technologies Figure 5: Leading IC Foundries' High-end Heterogeneous Packaging Technologies
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