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Global Chip Mounter Market 2016-2020

Published: Jun 28, 2016 | Pages: 58 | Publisher: Technavio | Industry: Semiconductors | Report Format: Electronic (PDF)

About the Chip Mounter Market
 
The chip mounting technology has progressed significantly over the last two decades in terms of a practical solution for achieving higher densities related to packaging systems. It started with the conventional through hole technology (THT), then resurfaced as surface mount technology (SMT) and fine pitch technology (FPT). Most manufacturers are using both SMT and THT to produce chips mounted on substrates. The dynamic semiconductor packaging technology has evolved with the help of THT (with component steers through 2.54 mm hole). Then comes SMT, which leads on 1.27 mm hole with minimal sized centers. The FPT leads on 0.63 mm as well as 0.50 mm centers. The component package mainly consists of a silicon-based die or integrated circuits chips, which got reduced to a large extent within the last two decades. Thus, the chip mounting technology has moved from a big diameter to a small diameter of space.
 
Technavio's analysts forecast the global chip mounter market to grow at a CAGR of 8.05% during the period 2016-2020.
 
Covered in this report 
The report covers the present scenario and the growth prospects of the global chip mounter market for 2016-2020. To calculate the market size, the report considers revenue from the sales of chip mounter equipment.
 
The market is divided into the following segments based on geography: 
• Americas
• APAC
• EMEA
 
Technavio's report, Global Chip Mounter Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors ?operating in this market. 
 
Key vendors 
• Hitachi
• Juki Corporation
• Nitto Denko Corporation
• Panasonic
• Yamaha Corporation
 
Other prominent vendors 
• ASM Pacific Technology
• Canon 
• Essemtec 
• Ohashi Engineering 
• Nordson 
• Samsung Techwin 
• Sony
• Sun Electric Industries
• TOA
 
Market driver 
• Growing adoption of communication-related consumer electronic gadgets
• For a full, detailed list, view our report 
 
Market challenge 
• Uncertain global economic conditions
• For a full, detailed list, view our report 
 
Market trend 
• Emergence of wearable technology
• For a full, detailed list, view our report 
 
Key questions answered in this report 
• What will the market size be in 2020 and what will the growth rate be?
• What are the key Market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the Key vendors in this market space?
• What are the market opportunities and threats faced by the Key vendors ?
• What are the strengths and weaknesses of the Key vendors ? 
 
You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.


 Table of Contents
PART 01: Executive summary • Highlights PART 02: Scope of the report • Report coverage • Base year and forecast period • Geographical segmentation • Common currency conversion rates • Vendor offerings PART 03: Market research methodology • Research methodology • Economic indicators PART 04: Introduction • Key market highlights • Technology landscape PART 05: Industry overview • Overview of semiconductor packaging industry • Global semiconductor industry value chain PART 06: Market landscape • Market overview • Market size and forecast • Five forces analysis PART 07: Market segmentation by technology • Global chip mounter market by technology • SMT segment • THT segment PART 08: Market segmentation by application • Global chip mounter market by application • Application segmentation PART 09: Geographical segmentation • Global chip mounter market by region • APAC • EMEA • Americas PART 10: Market drivers • Growing adoption of communication-related electronic gadgets • Increase in chip density • Miniaturization of electronics PART 11: Impact of drivers PART 12: Market challenges • Cyclical nature of semiconductor industry • Uncertain global economic conditions PART 13: Impact of drivers and challenges PART 14: Market trends • Growing focus on IoT • Increasing automation in automobiles • Emergence of wearable technology PART 15: Vendor landscape • Competitive scenario • Other prominent vendors PART 16: Market summary • Market figure snapshot PART 17: Appendix • List of abbreviations PART 18: Explore Technavio ? Exhibit 01: Global chip mounter market segmentation Exhibit 02: Major countries covered Exhibit 03: Currency conversion rates Exhibit 04: Product offerings Exhibit 05: Changes in semiconductor packaging size and component density Exhibit 06: Evolution of semiconductor IC packaging Exhibit 07:.5D IC packaging technology using TSVs and silicon interposers Exhibit 08:D semiconductor packaging technology using TSVs Exhibit 09: Semiconductor value chain Exhibit 10: Front-end processes Exhibit 11: Back-end processes Exhibit 12: Global chip mounter market forecast 2015-2020 ($ billions) Exhibit 13: Five forces analysis Exhibit 14: Global chip mounter market by technology 2015 Exhibit 15: Global chip mounter market by technology 2020 Exhibit 16: SMT segment forecast of global chip mounter market 2015-2020 ($ billions) Exhibit 17: THT segment forecast of global chip mounter market 2015-2020 ($ millions) Exhibit 18: Global chip mounter market by application 2015-2020 (% share) Exhibit 19: Global chip mounter market by application 2015-2020 ($ billions) Exhibit 20: Global chip mounter market by communication segment 2015-2020 ($ billions) Exhibit 21: Global chip mounter market by computer segment 2015-2020 ($ billions) Exhibit 22: Global chip mounter market by consumer electronics segment 2015-2020 ($ millions) Exhibit 23: Global chip mounter market by automotive segment 2015-2020 ($ millions) Exhibit 24: Global chip mounter market by region 2015 Exhibit 25: Global chip mounter market by region 2020 Exhibit 26: Chip mounter market in APAC 2015-2020 ($ billions) Exhibit 27: Chip mounter market in EMEA 2015-2020 ($ billions) Exhibit 28: Chip mounter market in Americas 2015-2020 ($ billions) Exhibit 29: Global smartphone shipment forecast 2015-2020 (millions of units) Exhibit 30: Global tablet shipments forecast 2015-2020 (millions of units) Exhibit 31: Impact of drivers Exhibit 32: Impact of drivers and challenges Exhibit 33: Other prominent vendors Exhibit 34: Key inferences Exhibit 35: Market summary of global chip mounter market 2015-2020 Exhibit 36: Technology segments: Year-over-year revenue comparison ($ billions) Exhibit 37: Geographical segments: Year-over-year revenue comparison ($ billions) Exhibit 38: Geographical segments: Year-over-year revenue comparison ($ billions)

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