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Global 3D Semiconductor Packaging Market 2016-2020

Published: Jun 28, 2016 | Pages: 54 | Publisher: Technavio | Industry: Semiconductors | Report Format: Electronic (PDF)

About the 3D Semiconductor Packaging Market
 
Recent technology advances along with improved durability, reduced energy consumption, superior performance, enhanced quality, and highly efficient features of 3D semiconductor packaging equipment are making this equipment attractive packaging proposition in the semiconductor industry, especially in the consumer electronics industry. The increasing demand for consumer electronics is expected to increase the revenue of the global 3D semiconductor packaging market during the forecast period. 
 
Technavio's analysts forecast the global 3D semiconductor packaging market to grow at a CAGR of 16.27% during the period 2016-2020.
 
Covered in this report 
The report covers the present scenario and the growth prospects of the global 3D semiconductor packaging market for 2016-2020. To calculate the market size, the report considers revenue generated from the sales of 3D semiconductor packaging equipment to semiconductor component manufacturers.
 
The market is divided into the following segments based on geography: 
• Americas
• APAC
• EMEA
 
Technavio's report, Global 3D Semiconductor Packaging Market 2016-2020, has been prepared based on an in-depth market analysis with inputs from industry experts. The report covers the market landscape and its growth prospects over the coming years. The report also includes a discussion of the Key vendors ?operating in this market. 
 
Key vendors 
• Amkor Technology
• SUSS Microtek 
• EV Group
• Tokyo Electron
 
Other prominent vendors 
• ACCRETECH Tokyo Seimitsu
• Rudolph Technologies
• SEMES
• Ultratech
• ULVAC
 
Market driver 
• Need to control chip design costs 
• For a full, detailed list, view our report 
 
Market challenge 
• High capital investment in 3D semiconductor packaging 
• For a full, detailed list, view our report 
 
Market trend 
• Short replacement cycle of portable electronic devices 
• For a full, detailed list, view our report 
 
Key questions answered in this report 
• What will the market size be in 2020 and what will the growth rate be?
• What are the key Market trends?
• What is driving this market?
• What are the challenges to market growth?
• Who are the Key vendors in this market space?
• What are the market opportunities and threats faced by the Key vendors ?
• What are the strengths and weaknesses of the Key vendors ? 
 
You can request one free hour of our analyst's time when you purchase this market report. Details are provided within the report.


 Table of Contents
PART 01: Executive summary • Highlights PART 02: Scope of the report • Definition • Report overview • Base year and forecast period • Geographical segmentation • Common currency conversion rates • Vendor offerings PART 03: Market research methodology • Research methodology • Economic indicators PART 04: Introduction • Key market highlights • Technology landscape • Industry overview • Global semiconductor industry value chain PART 05: Market landscape • Market overview • Market size and forecast • Five forces analysis PART 06: Market segmentation by application • Global 3D semiconductor packaging market by application 2015-2020 • Consumer electronics • Others PART 07: Geographical segmentation • 3D semiconductor packaging market in APAC • 3D semiconductor packaging market in EMEA • The Americas PART 08: Market drivers PART 09: Impact of drivers PART 10: Market challenges PART 11: Impact of drivers and challenges PART 12: Market trends PART 13: Vendor landscape • Competitive scenario • Other prominent vendors PART 14: Market summary PART 15: Appendix • List of abbreviations PART 16: Explore Technavio ? Exhibit 01: Global 3D semiconductor packaging market 2015 Exhibit 02: Product offerings Exhibit 03:D semiconductor packaging technology using TSVs Exhibit 04: Evolution of semiconductor IC packaging Exhibit 05: Color code indicating starting period of each packaging solutions Exhibit 06:.5 D IC packaging technology using TSVs and silicon interposer Exhibit 07: Semiconductor value chain Exhibit 08: Front-end processes Exhibit 09: Back-end processes Exhibit 10: Global 3D semiconductor packaging market 2015-2020 ($ billions) Exhibit 11: Five forces analysis Exhibit 12: Global 3D semiconductor packaging market by application 2015 Exhibit 13: Global 3D semiconductor packaging market by application 2020 Exhibit 14: Consumer electronics segment in global 3D semiconductor packaging market ($ billions) Exhibit 15: Global 3D semiconductor packaging market by others segment ($ millions) Exhibit 16: Revenue generation in 2015 Revenue generation in 2020 Exhibit 17:D semiconductor packaging market in APAC 2015-2020 ($ billions) Exhibit 18:D semiconductor packaging market in EMEA 2015-2020 ($ billions) Exhibit 19:D semiconductor packaging market in Americas 2015-2020 ($ millions) Exhibit 20: Global smartphone shipment forecast 2015-2020 (millions of units) Exhibit 21: Global tablet shipments forecast 2015-2020 (millions of units) Exhibit 22: Impact of drivers Exhibit 23: Impact of drivers and challenges Exhibit 24: Global MEMS market 2015-2020 ($ billions) Exhibit 25: Principle parameters of competition Exhibit 26: Comparison of leading vendors in global 3D semiconductor packaging market 2015 Exhibit 27: Amkor Technology: Revenue comparison from top application segments Exhibit 28: Other prominent vendors in global 3D semiconductor packaging market Exhibit 29: Market summary of 3D semiconductor packaging market 2015-2020 Exhibit 30: Application segments: Year-over-year revenue comparison ($ billions) Exhibit 31: Geographical segments: Year-over-year revenue comparison ($ billions) Exhibit 32: Application segments: Year-over-year revenue comparison (%) Exhibit 33: Geographical segments: Year-over-year revenue comparison (%)

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