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Published: Nov, 2015 | Pages:
48 | Publisher: Market Intelligence & Consulting Institute
Industry: Semiconductors | Report Format: Electronic (PDF)
3D IC has the advantages of high density, low power loss and high performance; it utilizes three-dimensional stack architecture to meet the future demand for compact and slim electronic products, and continues Moore's Law of the semiconductor industry. As Taiwan possesses the complete vertical supply chain for semiconductors, the country is suitable for developing three-dimensional stacking technology products, and is helpful in the integration of the semiconductor industry and technology rooting. This report provides an overview of the worldwide 3D IC market, touching on major application and regional markets, and major vendors of 3D IC key components in Taiwan. List of Topics Overview of the worldwide 3D IC market, touching on the major development trends and market value by application and by region Profile of major Taiwanese 3D IC equipment vendors across the supply chain, including an overview of technology and vendors' deployment at various segments of the supply chain, such as photolithography, dry etching, wet etching, coating, bonding, packaging and testing List of Companies Ad-STAC Air Liquide Air Product All Ring Technology AMAT Amkore Apex International Ares Green Technology Asahi Pretec Taiwan Asahi Shih Her Technologies ASE ASML AST AUO BOC Edwards Bosch C Sun MFG Camtek Career Technology ChangChun PetroChemical Chemleader Chilisin Electronics Chin Poon Industrial ChipMOS Compeq Manufacturing Cyantek DNP DNS Domino Automation Technology Dow Chemical Dupont Dynamic ECIC ELS System Technology EMAX TECH Epistar Eternal Materials Everlight Chemical EVG Feedpool Technology First Hi-tec Enterprise Founder Technology Foxconn Foxsemicon GMT Gold Circuit Electronics Gongin Precision Industrial GoWorld GPM GPTC HannStar Board Hermes Microvision Hermes-Epitek HiKE Holtek Honghow Hua Jung Hwasun Quartek IBM Innolux Inotera Memories INPAQ Technology ITRI IV Technologies Junze Kaijo Kaylu Industrial King Core Kingyoup Kinik Company Kinsus Interconnect Technology KYO L&K Engineering Lasertec Lextar Lite-On Technology LPI Machvision Macronix Marketech International Corp. Maxchip MEIKO Merk Messier-Dowty MiTAC Mitsubishi Mosel Vitelic MTC Nan Ya PCB Nano-Architect Research Corporation National Cheng Kung University National Tsing Hua University NEE Nichia Omron Orbotech Photronics Powerchip Prosys Technology Integration PSMC PTI Rippy S.E.S. Co. Ltd. Samsung Electro-Mechanics Scientech Screen Shin Her Technology Shinko Shira SHT Shuz Tung SMIC Song Jaan Technology Sonix SPIL Sumitomo Sun Rise E&T Sunplus SUSS T.N.E.T. Taiwan PCB Techvest Taiwan Union Technology TCE TEL Tengsen Tesla Motors TMC Top Creation Machines Toppan Tripod Technology TSMC TSR (Tekstarter) UMC Unimicron Technology Unitech United Integrated Services UTECHZONE VIS VisEra Walsin Win Semiconductor Winbond Electronics Xintec YAGEO Yuhchang Electric Yulon Group Zhen Ding Tec
Table of Contents 1. Worldwide 3D IC Market 1.1 Application Sectors 1.1.1 Consumer Electronics 1.1.2 ICT 1.1.3 Transportation (Automobiles and Aerospace) 1.1.4 Military 1.1.5 Others (Biomedical applications and R&D) 1.2 Regional Markets 1.2.1 North America 1.2.2 Europe 1.2.3 Asia Pacific 1.2.4 Rest of the World 1.3 Summary of the Worldwide 3D IC Market 2. Development of Key 3D IC Component Technologies and Vendors in Taiwan 2.1 Photolithography 2.1.1 Overview of the Technology 2.1.2 Supply Chain Players 2.2 Dry Etching 2.2.1 Overview of the Technology 2.2.2 Supply Chain Players 2.3 Wet Etching/Cleaning 2.3.1 Overview of the Technology 2.3.2 Supply Chain Players 2.4 Coating 2.4.1 Overview of the Technology 2.4.2 Supply Chain Players 2.5 Bonding 2.5.1 Overview of the Technology 2.5.2 Supply Chain Players 2.6 Packaging and Testing 2.6.1 Overview of the Technology 2.6.2 Supply Chain Players 2.7 Summary Conclusion Appendix Glossary of Terms List of Companies
List of Figures Figure 1: Worldwide 3D IC Market Value Contributed by Consumer Electronics Sector Figure 2: Worldwide 3D IC Market Value Contributed by ICT Sector Figure 3: Worldwide 3D IC Market Value Contributed by Transportation Sector Figure 4: Worldwide 3D IC Market Value Contributed by Military Sector Figure 5: Worldwide 3D IC Market Value Contributed by Other Sectors Figure 6: Worldwide 3D IC Market in 2012 and 2019 by Application Market Figure 7: Taiwanese 3D IC Equipment Supply Chain Figure 8: Temporary Bonding Figure 9: Laser De-bonding Figure 10: Illustration of CoWoS
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